at Intel in Springfield, Illinois, United States
Job Description
Job Description
About the Group
Technology Development (TD) is the heart and soul of Moore’s Law at Intel, enabling Intel to create world-changing technology that enriches the lives of every person on earth. TD drives breakthrough research and develops next generation process and packaging technologies, while also running high volume manufacturing operations in its state-of-the-art facilities in Oregon and Arizona. The Design Enablement (DE) team in TD works closely with the technology team to maximize the value proposition of the technology for our customers thru Design Technology Co-Optimization (DTCO), delivers the Process Design Kits (PDKs) and foundational IPs (FIPs), and carries out technology lead vehicle execution for Si validation. Enablement and optimization of EDA reference flow and design flow on Intel technology play a crucial role in accomplishing DE’s charter.
About the Role
Intel’s Advanced Design (AD) team resides within the Design Enablement (DE) organization which works in close collaboration with our partners in process technology, IP, and products spanning client/server and networking products. The primary focus of AD is to guide process technology definition, and design prototypes in Intel’s latest process technology, supporting Intel’s internal and external design customers.
As a Power Delivery Engineer in Advanced Design, you will design and analyze power delivery networks (PDN) and power regulators on Intel’s next-generation process technology, influence process technology features from the perspective of future product power requirements and interact with internal and foundry customers to support their adoption of Intel’s most advanced technology nodes.
Responsibilities include but are not limited to the following:
+ Design and modelling for IP and SoC PDNs including on-chip and on-package components.
+ Design and integration of power regulators and power regulator components on technology test chips.
+ Influence process technology features for next-generation technology nodes.
+ Benchmarking of technology features for PDN, including interconnect, bumps, passives, and transistors.
+ Design and analysis of component-level silicon characterization structures for PDN (e.g., high-density capacitors, through-silicon vias).
+ Be the process technology interface to internal and external customers on power delivery topics.
+ Serves as a team player leveraging excellent communication skills.
Qualifications
+ MS or PhD in Electrical Engineering or similar field.
+ 9+ years of experience in analog/mixed-signal circuit design for SoCs, test chips, and/or IPs
+ 3+ years’ experience in power delivery design.
Preferred Qualifications:
+ Understanding of design and analysis of on-die power delivery networks (PDN), power gating, package, and system power delivery.
+ Understanding of integrated power regulators.
+ Strong background in analog/mixed-signal design of integrated circuits.
Inside this Business Group
As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)
Annual Salary Range for jobs which could be performed in US, Colorado, New York, Washington, California: $162,041.00-$259,425.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
