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Lead Software Engineer [MR-LS-KD-3527]

at JP MORGAN CHASE & CO in Chicago, Illinois, United States

Job Description

JPMorgan Chase & Co

 

JOB TITLE: Lead Software Engineer

 

LOCATION: 10 South Dearborn Street, Chicago, IL 60603. Telecommuting permitted up to 40% of the week.

 

DUTIES:  Facilitate discussions with project managers, business analysts, and other software engineers to analyze business requirements and lead proposed IT solutions to develop software applications. Lead design reviews and provide recommendations that follow industry standard best practices related to security, information and data flow, and system design. Adhere to IT Control policies throughout the design, development, and testing lifecycle while ensuring the team follows the same principals. Understand Corporate Architectural Standards and incorporate them into designs while communicating standards with the team and documenting detailed application specifications. Review code change requests, providing meaningful feedback and mentoring junior engineers. Ensure automated testing is in place and aligns with business expectations. Monitor industry trends and actively propose system improvements to modernize and maintain system relevancy.

 

REQUIREMENTS: Bachelor’s degree in Computer Engineering, Computer Science, Information Technology, or related field of study plus 7 years of experience in the job offered or as a Lead Software Engineer, Software Developer, Software Engineer, or related occupation. Requires experience in the following: Windows; Agile SDLC; Application Architecture Disciplines; Data Architecture Disciplines; Microservices; Docker; Jenkins; Spring; Java; Javascript; SQL; REST; Maven; JSON; Oracle; GIT; Junit; Automated Testing; Unit Testing; and React. Full-time. To apply for this position, please email your resume to my.resume@jpmchase.com with following job ID clearly indicated: [MR-LS-KD-3527]. JPMorgan Chase & Co. is an Equal Opportunity and Affirmative Action Employer, M/F/D/V.

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Job Posting: 11784518

Posted On: Mar 27, 2024

Updated On: Apr 28, 2024

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