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Software Engineer [MR-SE-ACP-002550]

at JP MORGAN CHASE & CO in Chicago, Illinois, United States

Job Description

JPMorgan Chase & Co

JOB TITLE: Software Engineer

LOCATION: 10 South Dearborn Street, Chicago, IL 60603. Telecommuting permitted up to 40% of the week.

DUTIES:  Design and develop Micro UI applications that are compatible with all modern mobile device browsers and desktops. Responsible for the end-to-end architecture for all web components and adhere to industry best practices. Enhance current UI applications to use the latest micro front-based architecture. Responsible for UI development and mentor junior resources to follow best practices. Migrate applications running on the internal cloud to the public cloud. Automate integration and smoke tests to reduce the manual effort for new feature builds. Implement deployments using automated CI/CD pipelines to improve the efficiency of production deployment. Collaborate with business, product owners, and cross-impacted teams
for end- to- end delivery of product features.

REQUIREMENTS: 7 years of experience in the job offered or as Software Engineer, Software/Application Developer, UI
Developer, Technical Architect, Development Lead, Analyst (IT), or related occupation. The employer will alternatively
accept a Bachelor’s degree in Electrical and Electronic Engineering, Computer Science, Computer Engineering, Data Engineering, or related field of study plus 5 years of experience in the job offered or as Software Engineer,
Software/Application Developer, UI Developer, Technical Architect, Development Lead, Analyst (IT), or related occupation. Requires experience in the following: React JS; Typescript; CSS; AWS S3; EKS; Terraform; Jenkins; Cypress; Jest; Javascript.

Full-time.  To apply for this position, please email your resume to my.resume@jpmchase.com with following job ID clearly indicated: [MR-SE-ACP-002550]. JPMorgan Chase & Co. is an Equal Opportunity and Affirmative Action Employer, M/F/D/V.

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Job Posting: 12093654

Posted On: Aug 01, 2024

Updated On: Aug 01, 2024

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